Electrolytic treatment device and method

電解処理装置及び方法

Abstract

【課題】多様な仕様の製品に対して、その生産量を加味しながら最も生産性の高い状態での生産が可能で、生産コストの削減を図ることができ、しかも、配線の微細化などに対しても、柔軟に適用できるようにする。 【解決手段】基板を保持する基板保持部40と、基板保持部40で保持した基板に対向した位置に配置された対極板50とを備え、基板保持部40で保持した基板と対極板との間に電解液を満たしつつ給電して電解処理を行う電解処理ユニット30と、異なる種類の電解液を供給する複数の電解液供給設備32a,32bを備え、電解処理ユニット30は、複数の電解液供給設備32a,32bの一つと択一的に接続できるように構成されている。 【選択図】 図1
PROBLEM TO BE SOLVED: To provide an electrolitic treatment device capable of producing products with various specifications in a state of the highest productivity while considering the quantity of the production, reducing production cost, and being applied even to the miniaturization of wirings flexibly. SOLUTION: The electrolytic treatment device is equipped with: an electrolytic treatment unit 30 provided with a substrate holding part 40 of holding a substrate; and a counter plate 50 arranged at a position confronted with the substrate held by the substrate holding part 40; an elecyrolytic treatment unit 30 in which power is fed to the space between the substrate held by the substrate holding part 40 and the counter plate while an electrolytic solution is filled therein, and electrolytic treatment is performed; and a plurality of electrolytic solution feeding equipments 32a and 32b of feeding different kinds of electrolytic solutions. The electrolytic treatment unit 30 is constituted so as to alternatively be connected to one of the electrolytic solution feeding equipments 32a and 32b. COPYRIGHT: (C)2005,JPO&NCIPI

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    JP-2012092390-AMay 17, 2012Tokyo Electron Ltd, 東京エレクトロン株式会社Plating apparatus, plating method, and recording medium having plating program recorded thereon
    US-9731322-B2August 15, 2017Tokyo Electron LimitedPlating apparatus, plating method and storage medium having plating program stored thereon
    WO-2012056801-A1May 03, 2012東京エレクトロン株式会社Plating apparatus, plating method, and recording medium having plating program recorded thereon